◆ the coefficient of thermal expansion is well matched with semiconductor chip and ceramic substrate

◇ it has high thermal cycle capacity (compared with copper thermal cycle, it has tens of thousands of thermal cycles, and the module still works well)

◆ high thermal conductivity

◇200W/mK @25℃

◆ low density and light weight

◇ only 1 / 3 of copper

◇2.95-3.05g/cm?

◆ high rigidity and strength

◆ the surface is designed as a plane and an arch

◇ the chip is welded on the plane, and the arch surface is connected with the radiator

◆ standard size or free design size

◆ low cost casting scheme with slots and holes

◆ surface treatment

◇ the surface can be plated with matte nickel, bright nickel, etc

◇ after plating, it can be used as solder resist layer