AlSIC can be used in FCBGA package, high-density chip heat dissipation. The composite package of FCBGA and AlSiC heat sink is used to expand the heat conduction area on the back of the silicon chip of the ALSIC heat sink. This method makes the performance deviation outside the chip size insensitive, reduces the thermal resistance of the junction case (θjc) and makes the external heat sink or fan work more efficiently. HFCBGA can generate 6-8 watts of power consumption under natural convection.

Can install user design drawings to provide materials and processing or I provide design and processing